Novellus
We refurbish Novellus’ Concept I and Concept II (standard and shrink) CVD legacy products. The processes and applications we support include high density plasma (HDP) dielectric deposition on Speed tools, dielectric deposition (silane and TEOS based) on C1 and Sequel tools and tungsten deposition using C1-W and Altus tools. TS also offers labor service for Sabre electro-chemical deposition (ECD) tools used to deposit conducting metals for copper damascene applications.
GENERAL INFORMATION MATRIX | ||
---|---|---|
PLATFORMS | CVD | Concept I Concept II |
MODELS / APPLICATIONS | Altus: W Deposition | |
Speed: High Density Plasma | ||
Sequel: PECVD Dielectric | ||
WAFER SIZE | 150mm, 200mm (Equipment/Service) | |
PLATFORMS | ECD | Sabre |
APPICATION | Cu fill (Electro Copper Plating) | |
WAFER SIZE | 200mm and 300mm (Service Only) | |
PARTS | Only to support our internal projects |