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Novellus

We refurbish Novellus’ Concept I and Concept II (standard and shrink) CVD legacy products. The processes and applications we support include high density plasma (HDP) dielectric deposition on Speed tools, dielectric deposition (silane and TEOS based) on C1 and Sequel tools and tungsten deposition using C1-W and Altus tools. TS also offers labor service for Sabre electro-chemical deposition (ECD) tools used to deposit conducting metals for copper damascene applications.

GENERAL INFORMATION MATRIX
PLATFORMS CVDCVD Concept I
Concept II
MODELS / APPLICATIONS Altus: W Deposition
Speed: High Density Plasma
Sequel: PECVD Dielectric
WAFER SIZE 150mm, 200mm (Equipment/Service)
PLATFORMS Electro Copper DepositionECD Sabre
APPICATION Cu fill (Electro Copper Plating)
WAFER SIZE 200mm and 300mm (Service Only)
PARTS Only to support our internal projects

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